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Madaidaicin Laser

EPLC6080 Daidaitaccen Injin Fiber Laser Yankan na'ura don PCB Substrate Featured Image
  • EPLC6080 Daidaitaccen Injin Fiber Laser Yankan Machine don PCB Substrate

EPLC6080 Daidaitaccen Injin Fiber Laser Yankan Machine don PCB Substrate

Takaitaccen Bayani:

PCB substrate daidaici fiber Laser sabon inji ne yafi amfani da Laser microprocessing kamar yankan, hakowa, slotting, alama da sauran PCB aluminum substrates, jan karfe substrates, da yumbu substrates.


  • Ƙananan yankan kabu:20 ~ 40 ku
  • Babban daidaiton injina:≤±10um
  • Kyakkyawan incision:yankan santsi, ƙaramin yanki da zafi ya shafa, ƙarancin ƙora da guntuwar gefen
  • Girman gyare-gyare:mafi ƙarancin girman samfurin shine 20um

    • Cikakken Bayani

    PCB Substrate Precision Fiber Laser Yankan Machine

    PCB substrate madaidaicin fiber Laser sabon na'ura ne yafi amfani da Laser microprocessing kamar Laser sabon, hakowa da kuma rubutun daban-daban PCB substrates, wanda za a iya koma zuwa PCB Laser sabon inji ga takaice.Irin su PCB aluminum substrate yankan da kafa, jan karfe substrate sabon da forming, yumbu substrate sabon da forming, tinned jan karfe substrate Laser forming, guntu yankan da forming, da dai sauransu.

    Ma'aunin Fasaha:

    Matsakaicin saurin aiki 1000mm/s(X) ;1000mm/s(Yl&Y2) ;50mm/s
    Matsayi daidaito ± 3um (X) ± 3um (Y1&Y2) ± 5um (Z);
    Matsakaicin daidaitawa mai maimaitawa ±lum (X) ； ±lum(Y1&Y2) ；±3um（Z;
    Machining kayan daidai bakin karfe, wuya gami karfe da sauran kayan kafin ko bayan surface jiyya
    Kaurin bangon abu 0 ~ 2.0 ± 0.02mm;
    Kewayon injin jirgin sama 600mm * 800mm (goyan bayan gyare-gyare don buƙatun mafi girma)
    Nau'in Laser Fiber Laser;
    Laser tsawon zangon 1030-1070± 10nm;
    wutar lantarki CW1000W&CW2000W&QCW150W&QCW450W&QCW750W don zaɓi;
    Wutar lantarki ta kayan aiki 220V± 10%, 50Hz;AC 30A (babban kewayawa);
    Tsarin fayil DXF, DWG;
    Girman kayan aiki 1750mm*1850*1600mm;
    Nauyin kayan aiki 1800kg;

    Nunin Misali:

    hoto7

    Iyakar aikace-aikace
    Laser micromachining na jirgin sama da lankwasa surface kida na daidai bakin karfe da wuya gami kafin ko bayan surface jiyya.

    Machining mai inganci
    Ƙananan yankan kabu nisa: 20 ~ 40um
    Babban daidaiton injina: ≤ ± 10um
    օ Kyakkyawan ingancin incision: m incision & kananan zafi shafi yankin & kasa burr
    Girman gyare-gyare: mafi ƙarancin girman samfurin shine 100um

    Karfin daidaitawa
    օ Da ikon Laser yankan, hakowa, marking da sauran m machining na PCB substrate
    օ Can inji PCB aluminum substrate, jan karfe substrate, yumbu substrate da sauran kayan
    An sanye shi tare da ingantaccen dandamalin motsi na wayar hannu dual-drive mai haɓaka kai tsaye, dandamalin granite & daidaitawar shafting.
    օ Yana ba da matsayi guda biyu & matsayi na gani & atomatik loading da tsarin saukewa & sauran ayyuka na zaɓi
    օ Sanye take da kai ci gaba dogon & short mai da hankali tsawon kaifi bututun ƙarfe & lebur bututun ƙarfe Laser yankan shugaban օ Sanye take da musamman injin adsorption clamping tsayarwa & slag kura rabuwa tarin module & kura kau bututu tsarin & aminci fashewa-hujja magani tsarin
    An sanye shi da 2D & 2.5D & tsarin software na CAM don micromachining na Laser

    Zane mai sassauƙa
    Bi ra'ayin ƙira na ergonomics, m da taƙaitacce
    օ software mai sassauƙa & haɗin aikin kayan masarufi, yana goyan bayan ƙayyadaddun tsarin aiki na keɓaɓɓen & sarrafa samarwa na hankali
    օ Taimakawa ingantaccen ƙirar ƙira daga matakin sashi zuwa matakin tsarin
    օ Buɗe sarrafawa & tsarin software micromachining laser mai sauƙin aiki & keɓancewar fahimta

    Takaddun shaida na fasaha
    Ƙaddamar da CE
    Ƙaddamar da ISO9001
    Saukewa: IATF16949

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